Blind and Buried Via PCB
Product Details:
| Number of Layers | 8-Layer |
|---|---|
| Copper Thickness | 1 OZ |
| Min. Hole Size | 0.1mm (4 mil) |
| Min. Line Spacing | 0.1mm (4 mil) |
| Min. Line Width | 0.1mm (4 mil) |
| Board Thickness | 1.6mm |
| Base Material | FR-4 |
| Place of Origin | China |
Payment & Shipping Terms:
| Packaging Details: | vacuum-packed |
|---|---|
| Delivery Time: | 3 weeks |
| Supply Ability: | 10000 Set/Sets per Month |
Detailed Product Description
Our capability:
No. Of Layers Available 1- 24
Min. Line Width 0. 10mm
Min. Line Spacing 0. 10mm
Min. Annual Ring PTH 0. 15mm
Non-PTH 0. 10mm
Min Hole Size PTH 0. 10mm
Non-PTH 0. 20mm
Hole Aspect Ratio 8
Min. Board Thickness Single & Double Sided 0. 2mm
Multilayer (4, 6, 8, 10) 0. 4mm, 1. 0mm, 1. 2mm, 1. 5mm
Max Board Size 450mm X 800mm
Solder Mask Pitch 0. 1mm
Hole Tolerance PTH +/- 0. 076mm
Non-PTH +/- 0. 05mm
Hole Position Tolerance +/- 0. 076mm
Outline Tolerance Routing +/- 0. 15mm
Punching +/- 0. 15mm
Thickness Tolerance MIL-P-13949 Class 2
V-Cut Tolerance Depth +/- 0. 15mm
Position +/- 0. 15mm
Gold Finger 1 U" - 40 U"
Blind and Buried Via PCB
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Company Info
Multech Electronic Limited
[China]
[Verified Member]
City: Shenzhen
Province/State: Guangdong
Country/Region : China
Business Type:Manufacturer, Trading Company, Business Service (Transportation, finance, travel, Ads, etc)
Online Postings: Products