Detailed Product Description

Reference--Manufacturing Capability:
Layer:1-18 layer Rigid PCB
1. Material: FR-4, FR-4 HIGHT TG(170), CEM-1, CEM-3, Rogers, Aluminum-base material
2. Board thickness: From Min.0.2mm to Max.6.0mm
3. Copper Thickness: 18um(0.5 oz)---175um(4 oz)
4. Surface Finish: HAL, HAL LEAD Free, OSP(Entek), Immersion Gold, Immersion Tin/Silver, Flash Gold
5. Conductor Trace and Gap:Min.0.125.(5mil)
6. Drill hole:Min.0.2mm(8mil)
7. Solder mask: LPI, Green / Red / Blue / Yellow / White / Black / Matte Black
8. Silkscreen: White, Black, Yellow
9. Carbon lnk, available
10. Peelable Mask, available
11. Blind / Buried hole, available
12. Tolerance:
   1). Hole Diameter:+/-0.05mm for PTH,+/-0.025mm for NPTH
   2). Hole Position:+/-0.025mm 
   3). Outline:+/-0.1mm